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PCK942P
Low voltage 1 : 18 clock distribution chip
Rev. 01 -- 17 February 2006 Product data sheet
1. General description
The PCK942P is a 1 : 18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS output capabilities. The device is offered in two versions: the PCK942C has an LVCMOS input clock, while the PCK942P has a LVPECL input clock. The 18 outputs are 2.5 V or 3.3 V LVCMOS compatible and feature the drive strength to drive 50 series-terminated transmission lines. With output-to-output skews of 200 ps, the PCK942P is ideal as a clock distribution chip for the most demanding of synchronous systems. The 2.5 V output also makes the device ideal for supplying clocks for a higher performance Pentium II microprocessor-based design. With a low output impedance of approximately 12 , in both the HIGH and LOW logic states, the output buffers of the PCK942P are ideal for driving series-terminated transmission lines. With an output impedance of 12 , the PCK942P can drive two series-terminated transmission lines from each output. This capability gives the PCK942P an effective fan-out of 1 : 36. The PCK942P provides enough copies of low skew clocks for most high performance synchronous systems. The differential LVPECL inputs of the PCK942P allow the device to interface directly with a LVPECL fan-out buffer like the MC100EP111 to build very wide clock fan-out trees or to couple to a high frequency clock source. The OE pin will place the outputs to a high-impedance state. The OE pin has an internal pull-up resistor. The PCK942P is a single supply device. The VCC power pins require either 2.5 V or 3.3 V. The 32-lead LQFP package was chosen to optimize performance, board space, and cost of the device. The 32-lead LQFP package has a 7 mm x 7 mm body size with a conservative 0.8 mm pin spacing.
2. Features
s s s s s s LVPECL clock input 2.5 V LVCMOS outputs for Pentium II microprocessor support 200 ps maximum targeted output-to-output skew Maximum output frequency of 250 MHz at 3.3 V VCC 32-lead LQFP packaging Single 3.3 V or 2.5 V supply voltage
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
3. Ordering information
Table 1: Ordering information Package Name PCK942PBD LQFP32 Description plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm Version SOT358-1 Type number
4. Functional diagram
Q0
PCK942P
PECL_CLK PECL_CLK
Q1 to Q16
Q17 OE (internal pull-up)
002aaa674
Fig 1. Functional diagram of PCK942P
5. Pinning information
5.1 Pinning
25 GND 24 Q6 23 Q7 22 Q8 21 VCC 20 Q9 19 Q10 18 Q11 17 GND Q16 10 Q15 11 GND 12 Q14 13 Q13 14 Q12 15 VCC 16 9
002aaa675
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
29 VCC
32 Q0
31 Q1
30 Q2
28 Q3
27 Q4
GND GND OE n.c. PECL_CLK PECL_CLK VCC VCC
1 2 3 4 5 6 7 8
PCK942PBD
Fig 2. Pin configuration for LQFP32
9397 750 12261
Product data sheet
Rev. 01 -- 17 February 2006
Q17
26 Q5
2 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
5.2 Pin description
Table 2: Symbol GND OE n.c. PECL_CLK, PECL_CLK Q[0:17] Pin description Pin 1, 2, 12, 17, 25 3 4 5, 6 Description ground output enable not connected differential clock inputs
32, 31, 30, 28, 27, 26, outputs 24, 23, 22, 20, 19, 18, 15, 14, 13, 11, 10, 9 7, 8, 16, 21, 29 supply voltage
VCC
6. Functional description
6.1 Function table
Table 3: OE 0 1 Function table Output high-impedance outputs enabled
7. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI II Tstg Parameter supply voltage input voltage input current storage temperature CMOS inputs Conditions Min -0.3 -0.3 -40 Max +3.6 VDD + 0.3 20 +125 Unit V V mA C
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
3 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
8. Static characteristics
Table 5: Static characteristics Tamb = 0 C to 70 C; VCC = 2.5 V 5 % Symbol VIH VIL Vi(p-p) VIX VOH VOL II Ci CPD Zo Iq(max) Parameter HIGH-state input voltage LOW-state input voltage peak-to-peak input voltage crosspoint voltage of differential inputs HIGH-state output voltage LOW-state output voltage input current input capacitance power dissipation capacitance output impedance maximum quiescent current per output PECL_CLK PECL_CLK IOH = -16 mA IOL = 16 mA Conditions Min 2.0 0.6 2.0 Typ 4.0 14 12 0.5 Max VCC 0.8 1.0 0.5 200 5.0 Unit V V V V V A pF pF mA
VCC - 1.0 -
VCC - 0.6 V
Table 6: Static characteristics Tamb = 0 C to 70 C; VCC = 3.3 V 5 % Symbol VIH VIL Vi(p-p) VIX VOH VOL II Ci CPD Zo Iq(max) Parameter HIGH-state input voltage LOW-state input voltage peak-to-peak input voltage crosspoint voltage of differential inputs HIGH-state output voltage LOW-state output voltage input current input capacitance power dissipation capacitance output impedance maximum quiescent current per output PECL_CLK PECL_CLK IOH = -20 mA IOL = 20 mA Conditions Min 2.4 0.6 2.4 Typ 4.0 14 12 0.5 Max VCC 0.8 1.0 0.6 200 5.0 Unit V V V V V A pF pF mA
VCC - 1.0 -
VCC - 0.6 V
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
4 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
9. Dynamic characteristics
Table 7: Dynamic characteristics Tamb = 0 C to 70 C; VCC = 2.5 V 5 % Symbol foper(max) tPLH tPHL tsk(o) tsk(pr) tr tf
[1] [2]
Parameter maximum operating frequency LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay output skew time process skew time rise time fall time
Conditions
Min 1.8 2.0
Typ -
Max 200 4.0 4.3 200 2.2 1.3 1.0 1.0
Unit MHz ns ns ps ns ps ns ns
output-to-output part-to-part part-to-part output output
[2] [1]
0.1 0.1
For a specific temperature and voltage, includes output skew. Across temperature and voltage ranges, includes output skew.
Table 8: Static characteristics Tamb = 0 C to 70 C; VCC = 3.3 V 5 % Symbol foper(max) tPLH tPHL tsk(o) tsk(pr) tr tf
[1] [2]
Parameter maximum operating frequency LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay output skew time process skew time rise time fall time
Conditions
Min 1.5 1.5
Typ -
Max 250 3.2 3.6 200 1.7 1.0 1.0 1.0
Unit MHz ns ns ps ns ps ns ns
output-to-output part-to-part part-to-part output output
[2] [1]
0.1 0.1
For a specific temperature and voltage, includes output skew. Across temperature and voltage ranges, includes output skew.
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
5 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
10. Package outline
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1
c
y X
24 25
17 16 ZE
A
e E HE wM bp pin 1 index 32 1 e bp D HD wM B vM B 8 ZD vM A 9 detail X L Lp A A2 A 1 (A 3)
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.4 0.3 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.8 HD 9.15 8.85 HE 9.15 8.85 L 1 Lp 0.75 0.45 v 0.2 w 0.25 y 0.1 Z D (1) Z E (1) 0.9 0.5 0.9 0.5 7 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT358 -1 REFERENCES IEC 136E03 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 03-02-25 05-11-09
Fig 3. Package outline SOT358-1 (LQFP32)
9397 750 12261 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
6 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
11. Soldering
11.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
11.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
11.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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Product data sheet
Rev. 01 -- 17 February 2006
7 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
11.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
11.5 Package related soldering information
Table 9: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
8 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
12. Abbreviations
Table 10: Acronym LVCMOS LVPECL Abbreviations Description Low Voltage Complementary Metal Oxide Silicon Low Voltage Positive Emitter Coupled Logic
13. Revision history
Table 11: Revision history Release date 20060217 Data sheet status Product data sheet Change notice Doc. number 9397 750 12261 Supersedes Document ID PCK942P_1
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
9 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
14. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
15. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
17. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 12261
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2006
10 of 11
Philips Semiconductors
PCK942P
Low voltage 1 : 18 clock distribution chip
19. Contents
1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 11 11.1 11.2 11.3 11.4 11.5 12 13 14 15 16 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 7 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7 Manual soldering . . . . . . . . . . . . . . . . . . . . . . . 8 Package related soldering information . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information . . . . . . . . . . . . . . . . . . . . 10
(c) Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 17 February 2006 Document number: 9397 750 12261
Published in The Netherlands

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